The global new energy industry—spanning lithium-ion batteries for electric vehicles (EVs) and energy storage, photovoltaic (PV) modules for solar power, and hydrogen fuel cells for clean transportation—has become a cornerstone of the low-carbon transition. As production scales expand and technologies advance, the industry faces unprecedented demands for precision: battery electrode coatings require ±2μm thickness uniformity to avoid thermal runaway, PV cell micro-cracks as small as 10μm can cut power output by 5%, and hydrogen fuel cell bipolar plates need ±0.01mm channel precision for efficient gas flow. Conventional fixed-focus industrial lenses struggle to keep up—frequent refocusing slows production, and limited adaptability fails to address diverse component sizes (from 1m-wide PV panels to 0.1mm-thin battery separators).

The semiconductor industry’s relentless pursuit of smaller process nodes (now advancing to 2nm and beyond) and more complex packaging technologies (such as 3D ICs and Chiplet designs) has pushed measurement requirements to unprecedented levels. Traditional contact-based measurement tools risk damaging fragile semiconductor components, while conventional optical sensors often struggle with nanoscale accuracy and compatibility with diverse materials—from reflective silicon wafers to transparent thin films. Enter the point spectral confocal sensor—a non-contact, high-precision measurement technology that leverages spectral confocal imaging principles to achieve nanoscale resolution, making it a game-changer for semiconductor manufacturing and inspection.