The semiconductor industry’s relentless pursuit of smaller process nodes (now advancing to 2nm and beyond) and more complex packaging technologies (such as 3D ICs and Chiplet designs) has pushed measurement requirements to unprecedented levels. Traditional contact-based measurement tools risk damaging fragile semiconductor components, while conventional optical sensors often struggle with nanoscale accuracy and compatibility with diverse materials—from reflective silicon wafers to transparent thin films. Enter the point spectral confocal sensor—a non-contact, high-precision measurement technology that leverages spectral confocal imaging principles to achieve nanoscale resolution, making it a game-changer for semiconductor manufacturing and inspection.